HDI Rigid-Flex PCB

Design: 1 to 16 layers, plated-through(Rigid-Flex PCB)

Conductor width min.:0.076mm 
Annular ring min.:0.1mm 
Via min.: 0.15mm 
Surfaces:Chemical gold (recommended),
Materials: FR4, Polyimide, high Tg polyimide Materials
FPC Material thickness: 0.15mm min. 
Copper thickness: from 18um 
Stiffener available thicknesses are: 0,075mm - 3,20mm.(Steel, or PI, or FR4)
Polyimid-Stiffener: 0,025mm - 0,225mm
FR4-Stiffener: 0,075mm - 3,20mm
Max. size:250mm x 450mm larger on request
Cover Coverlay or flexible solder-stop 
Cover bridge Coverlay: ≥ 200µm