Process |
Item |
Process Capability |
|
Base Information
|
Production Capability |
Layer count | 1-30 layers |
| Bow and twist | 0.75% standard, 0.5% advanced | ||
| Min. finished PCB size | 10 x 10mm(0.4 x 0.4") | ||
| Max. finished PCB size | 530 x 1200mm(20.9 x 47.24 ") | ||
| Multi-press for blind/buried vias | Multi-press Cycle≤3 times | ||
| Finished board thickness | 0.3 ~ 7.0mm(8 ~ 276mil) | ||
| Finished board thickness tolerance | +/-10% standard, +/-0.1mm advanced | ||
| Surface finish | HASL, Lead free HASL, Flash gold, ENIG, OSP, Immersion Tin, Immersion silver, Hard gold plating, Carbon, etc | ||
| Selective surface finish | ENIG+OSP, ENIG+Gold finger, Flash gold+HASL, | ||
Material Type |
High Tg material | S1170(Shengyi Tg>170℃) | |
| Impedance Control Material | FR4, FR4 High Tg series | ||
| RCC material | Copper foil thickness 12um, Dielectric Thickness 65,80,100um(55,70,90um after pressing) | ||
| Copper foil | 1/3oz ~ 8oz | ||
Prepreg Type |
FR4 Prepreg, LD-1080(HDI) | 106, 1080, 3313, 2313, 2116, 7628 | |
Reliable Test |
Peel strength | 7.8N/cm | |
| Fammability | 94V-0 | ||
| Ionic contamination | ≤1ug/cm² | ||
| Min. dielectric thickness | 0.075mm(3mil) | ||
| Impedance tolerance | +/-10% for impedance ≥50Ω, +/-5Ω for impedance ≤50Ω | ||
Inner layer&Outer layer Image Transfer |
Machine Capability |
Scrubbing Machine | Material thickness: 0.11 ~ 3.2mm(4.33mil ~ 126mil) |
| Material size: min. 228 x 228mm(9 x 9") | |||
| Laminator, Exposer | Material thickness: 0.11 ~ 6.0mm(4.33 ~ 236mil) | ||
| Material size: min 203 x 203mm(8 x 8"), max. 609.6 x 1200mm(24 x 30 ") | |||
| Etching Line | Material thickness: 0.11 ~ 6.0mm(4.33mil ~ 236mil) | ||
| Material size: min. 177 x 177mm(7 x 7") | |||
Inner layer Process Capability |
Min. inner line width/spacing | 0.075/0.075mm(3/3mil) | |
| Min. spacing from hole edge to conductive | 0.2mm(8mil) | ||
| Min. inner layer annular ring | 0.1mm(4mil) | ||
| Min. inner layer isolation clearance | 0.25mm(10mil) standard, 0.2mm(8mil) advanced | ||
| Min. spacing from board edge to conductive | 0.2mm(8mil) | ||
| Min. gap width between copper ground | 0.127mm(5mil)? | ||
| Unbalance copper thickness for inner core | H/1oz, 1/2oz | ||
| Max. finished copper thickness | 5oz | ||
Outer layer Process Capability |
Min. outer line width/spacing | 0.075/0.075mm(3/3mil) | |
| Min. hole pad size | 0.3mm(12mil) | ||
Process Capability |
Max. slot tenting size | 5 x 3mm(196.8 x 118mil) | |
| Max. tenting hole size | 4.5mm(177.2mil) | ||
| Min. tenting land width | 0.2mm(8mil) | ||
| Min. annular ring | 0.1mm(4mil) | ||
| Min. BGA pitch | 0.5mm(20mil) | ||
AOI |
Machine Capability |
Orbotech SK-75 AOI | Material thickness: 0.05 ~ 6.0mm(2 ~ 236.2mil) |
| Material size: max. 597 ~ 597mm(23.5 x 23.5") | |||
| Orbotech Ves Machine | Material thickness: 0.05 ~ 6.0mm(2 ~ 236.2mil) | ||
| Material size: max. 597 ~ 597mm(23.5 x 23.5") | |||
Drilling |
Machine Capability |
MT-CNC2600 Drill machine | Material thickness: 0.11 ~ 6.0mm(4.33 ~ 236mil) |
| Material size: max. 470 ~ 660mm(18.5 x 26") | |||
| Min. drill size: 0.2mm(8mil) | |||
Process Capability |
Min. multi-hit drill bit size | 0.55mm(21.6mil) | |
| Max. aspect ratio(finished board size VS Drill size) | 12:1 | ||
| Hole location tolerance(compared with CAD) | +/-3mil | ||
| Counterbore hole | PTH&NPTH, Top angle 130°,Top diameter <6.3mm | ||
| Min. spacing from hole edge to conductive | 0.2mm(8mil) | ||
| Max. drill bit size | 6.5mm(256mil) | ||
| Min. multi-hit slot size | 0.45mm(17.7mil) | ||
| Hole size tolerance for press fit | +/-0.05mm(+/-2mil) | ||
| Min. PTH slot size tolerance | +/-0.15mm(+/-6mil) | ||
| Min. NPTH slot size tolerance | +/-2mm(+/-78.7mil) | ||
| Min. spacing from hole edge to conductive(Blind vias) | 0.23mm(9mil) | ||
| Min. laser drill size | 0.1mm(+/-4mil) | ||
| Countersink hole angle&Diameter | Top 82,90,120° | ||
Wet Process |
Machine Capability |
Panel&Pattern plating line | Material thickness: 0.2 ~ 7.0mm(8 ~276mil) |
| Material size: max. 610 x 762mm(24 x 30") | |||
| Deburring Maching | Material thickness: 0.2 ~ 7.0mm(8 ~276mil) | ||
| Material size: min. 203 x 203mm(8" x 8") | |||
| Desmear Line | Material thickness: 0.2mm ~ 7.0mm(8 ~276mil) | ||
| Material size: max. 610 x 762mm(24 x 30") | |||
| Tin plating line | Material thickness: 0.2 ~ 3.2mm(8 ~126mil) | ||
| Material size: max. 610 x 762mm(24 x 30") | |||
Process Capability |
Hole wall copper thickness | average 25um(1mil) standard | |
| Finished copper thickness | ≥18um(0.7mil) | ||
| Min line width for etching marking | 0.2mm(8mil)) | ||
| Max.finished copper weight for inner&outer layers | 6oz | ||
| Different copper thickness | H/1oz, 1/2oz | ||
Solder Mask& Silkscreen |
Machine Capability |
Scrubbing Machine | Material thickness: 0.5 ~ 7.0mm(20 ~ 276mil) |
| Material size: min. 228 x 228mm(9 x 9") | |||
| Exposer | Material thickness: 0.11 ~ 7.0mm(4.3 ~ 276mil) | ||
| Material size: max. 635 x 813mm(25 x 32") | |||
| Develop machine | Material thickness: 0.11 ~ 7.0mm(4.3 ~ 276mil) | ||
| Material size: min. 101 x 127mm(4 x 5") | |||
Color |
Solder mask color | Green, matte green, yellow, black, blue, red, white | |
| Silkscreen color | White, yellow, black, blue | ||
Solder Mask Capability |
Min. solder mask opening | 0.05mm(2mil) | |
| Max. plugged via size | 0.65mm(25.6mil) | ||
| Min. width for line coverage by S/M | 0.05mm(2mil) | ||
| Min. solder mask legends width | 0.2mm(8mil) standard, 0.17mm(7mil) advanced | ||
| Min. solder mask thickness | 10um(0.4mil) | ||
| Solder mask thickness for via tenting | 10um(0.4mil) | ||
| Min. carbon oil line width/spacing | 0.25/0.35mm(10/14mil) | ||
| Min. tracer of carbon | 0.06mm(2.5mil) | ||
| Min. carbon oil line trace | 0.3mm(12mil)) | ||
| Min. spacing from carbon pattern to pads | 0.25mm(10mil) | ||
| Min. width for peelable mask cover line/pad | 0.15mm(6mil) | ||
| Min. solder mask bridge width | 0.1mm(4mil)) | ||
| Solder mask Hardness | 6H | ||
Peelable Mask Capability |
Min. spacing from peelable mask pattern to pad | 0.3mm(12mil)) | |
| Max. size for peelable mask tent hole(By screen printing) | 2mm(7.8mil) | ||
| Max. size for peelable mask tent hole(By aluminum printing) | 4.5mm | ||
| Peelable mask thickness | 0.2 ~ 0.5mm(8 ~20mil) | ||
Silkscreen Capability |
Min. silkscreen line width | 0.11mm(4.5mil) | |
| Min. silkscreen line height | 0.58mm(23mil) | ||
| Min. spacing from legend to pad | 0.17mm(7mil) | ||
Surface Finish |
Surface Finish Capability |
Max. gold finger length | 50mm(2") |
| ENIG | 3 ~ 5um(0.11 ~ 197mil) nickel, 0.025 ~ 0.1um(0.001 ~ 0.004mil) gold | ||
| gold finger | 3 ~ 5um(0.11 ~ 197mil) nickel, 0.25 ~ 1.5um(0.01 ~ 0.059mil) gold | ||
| HASL | 0.4um(0.016mil) Sn/Pb | ||
| HASL Machine | Material thickness: 0.6 ~ 4.0mm(23.6 ~ 157mil) | ||
| Material size: 127 x 127mm ~ 508 x 635mm(5 x 5" ~ 20 x 25") | |||
| Hard gold plating | 1-5u" | ||
| Immersion Tin | 0.8 ~ 1.5um(0.03 ~ 0.059mil) Tin | ||
| Immersion Silver | 0.1 ~ 0.3um(0.004 ~ 0.012mil) Ag | ||
| OSP | 0.2 ~ 0.5um(0.008 ~ 0.02mil) | ||
E-Test |
Machine Capability |
Flying probe tester | Material thickness: 0.4 ~ 6.0mm(15.7 ~ 236mil) |
| Material size: max. 498 x 597mm(19.6 ~ 23.5") | |||
| Min. spacing from test pad to board edge | 0.5mm(20mil) | ||
| Min. conductive resistance | 5Ω | ||
| Max. insulation resistance | 250mΩ | ||
| Max. test voltage | 500V | ||
| Min. test pad size | 0.15mm(6mil)) | ||
| Min. test pad to pad spacing | 0.25mm(10mil) | ||
| Max. test current | 200mA | ||
Profiling |
Machine Capability |
Profiling type | NC routing, V-cut, slot tabs, stamp hole |
| NC routing machine | Material thickness: 0.05 ~ 7.0mm(2 ~ 276mil) | ||
| Material size: max. 546 x 648mm(21.5 x 25.5") | |||
| V-cut machine | Material thickness: 0.6 ~ 3.0mm(23.6 ~ 118mil) | ||
| Max material width for V-cut: 457mm(18") | |||
Process Capability |
Min. routing bit size | 0.6mm(23.6mil) | |
| Min. outline tolerance | +/-0.1mm(+/-4mil) | ||
| V-cut angle type | 20°, 30°, 45°, 60° | ||
| V-cut angle tolerance | +/-5° | ||
| V-cut registration tolerance | +/-0.1mm(+/-4mil ) | ||
| V-cut web thickness tolerance | +/-0.05mm(+/-2mil) | ||
| Min. gold finger spacing | +/-0.15mm(+/-6mil) | ||
| Min. spacing to avoid gold finger tab bevelled | +/-0.17mm(+/-7mil) | ||
| Bevelling angle tolerance | +/-5° | ||
| Bevelling remain thickness tolerance | +/-0.127mm(+/-5mil) | ||
| Min. inner radius | 0.4mm(15.7mil) | ||
| Min. spacing from conductive to outline | 0.2mm(8mil) | ||
| Countersink/Counterbore depth tolerance | +/-0.1mm(+/-4mil) | ||
