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Multi-layers FPC

 

 

层数/ Layers：4-Layers

板厚/ Thickness: 0.25mm

最小孔径/ Min.Hole Size: 0.15mm

线宽线距/ Width/Spacing：3.0/3.0mil

表面处理/ Surface Treatment: ENIG

补强/ Stiffener：PI

特别要求/ Special: Impedance


 

 

Technology Capability Introduction:

Design: 1 to 10 layers, plated-through

Conductor width min.:0.1mm 
Annular ring min.:0.1mm 
Via min.: 0.15mm 
Surfaces:Chemical gold (recommended),
Materials: Polyimide, high Tg polyimide Materials
Material thickness: 0.15mm min. 
Copper thickness: from 18um 
Stiffener available thicknesses are: 0,075mm - 3,20mm.(Steel, or PI, or FR4)
Polyimid-Stiffener: 0,025mm - 0,225mm
FR4-Stiffener: 0,075mm - 3,20mm
Max. size:250mm x 450mm larger on request
Cover Coverlay or flexible solder-stop 
Cover bridge Coverlay: ≥ 200µm

UL certification for flexible circuit boards
Impedance control:Yes (10% tolerance)		  

 

 

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